Scalable high-bandwidth connectivity

ABSTRACT

A scalable, high-bandwidth connectivity architecture for portable storage devices and memory modules may utilize EHF communication link chip packages mounted in various two-dimensional and three-dimensional configurations on planar surfaces such as printed circuit boards. Multiple electromagnetic communication links between devices distributed on major faces of card-like devices may be provided with respectively aligned pairs of communication units on each device. Adjacent communication units on a printed circuit board may transmit or receive electromagnetic radiation having different polarization, such as linear or elliptical polarization. Power and communication between communication devices may both be provided wirelessly.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.13/471,052, filed May 14, 2012 and entitled “Scalable High-BandwidthConnectivity”, which application claims the benefit of the followingU.S. Provisional Patent Applications: (i) Ser. No. 61/485,543, filed onMay 12, 2011 and entitled “Scalable High-Bandwidth Connectivity Methodand Apparatus”; (ii) Ser. No. 61/535,277, filed on Sep. 15, 2011 andentitled “Wireless Power And Data Transfer System”; (iii) Ser. No.61/549,378, filed on Oct. 20, 2011 and entitled “Zero HeightConnectors”; and (iv) Ser. No. 61/607,449, filed on Mar. 6, 2012 andentitled “Multi-Antenna EHF Devices And Systems”; which applications areincorporated herein by reference in their entirety for all purposes.

This application is also a continuation of U.S. patent application Ser.No. 13/471,058, filed May 14, 2012 and entitled “Scalable High-BandwidthConnectivity”, which application claims the benefit of the followingU.S. Provisional Patent Applications: (i) Ser. No. 61/485,543, filed onMay 12, 2011 and entitled “Scalable High-Bandwidth Connectivity Methodand Apparatus” and (ii) Ser. No. 61/535,277, filed on Sep. 15, 2011 andentitled “Wireless Power And Data Transfer System”; which applicationsare incorporated herein by reference in their entirety for all purposes.

FIELD OF THE DISCLOSURE

This disclosure relates to systems and methods for EHF communications,including communication associated with modular and portable memorydevices.

BACKGROUND OF THE DISCLOSURE

Advances in semiconductor manufacturing and circuit design technologieshave enabled the development and production of integrated circuits (ICs)with increasingly higher operational frequencies. In turn, electronicproducts and systems incorporating such integrated circuits are able toprovide much greater functionality than previous generations ofproducts. This additional functionality has generally included theprocessing of increasingly larger amounts of data at increasingly higherspeeds.

Many electronic systems include multiple printed circuit boards (PCBs)upon which these high-speed ICs are mounted, and through which varioussignals are routed to and from the ICs. In electronic systems with atleast two PCBs and the need to communicate information between thosePCBs, a variety of connector and backplane architectures have beendeveloped to facilitate information flow between the boards. Connectorand backplane architectures introduce a variety of impedancediscontinuities into the signal path, resulting in a degradation ofsignal quality or integrity. Connecting to boards by conventional means,such as signal-carrying mechanical connectors, generally createsdiscontinuities, requiring expensive electronics to negotiate.Conventional mechanical connectors may also wear out over time, requireprecise alignment and manufacturing methods, and are susceptible tomechanical jostling.

SUMMARY OF THE DISCLOSURE

In one example, an EHF communication unit may include a die having atransmitter circuit and a receiver circuit. A first antenna may beoperatively connected to the transmitter circuit. A second antenna maybe operatively connected to the receiver circuit. Dielectric materialmay encapsulate and hold in relative spaced relationship the firstantenna, the second antenna, and the die. The first and second antennasmay transmit or receive electromagnetic radiation having differentrespective polarization characteristics.

In a further example, a system may include first and secondcommunication devices. The first communication device may include afirst EHF electromagnetic comm-link chip having a first antennaconfigured as a transmitter and a second antenna configured as areceiver. The second communication device may include a second EHFcomm-link chip having a third antenna configured as a transmitter and afourth antenna configured as a receiver. The first antenna may beconfigured to transmit and the fourth antenna may be configured toreceive electromagnetic radiation having a first polarizationcharacteristic. The third antenna may be configured to transmit and thesecond antenna may be configured to receive electromagnetic radiationhaving a second polarization characteristic that is different than thefirst polarization characteristic. The first device and the seconddevice may be configured so that when the first device is placedproximate to and in lateral alignment with the second device, the firstantenna is aligned with and facing the fourth antenna and the secondantenna is aligned with and facing the third antenna.

In another example, a chip assembly may have a first EHF comm-link chip,a first antenna operatively coupled to the first EHF comm-link chip, asecond EHF comm-link chip, a second antenna operatively coupled to thesecond EHF comm-link chip, and a dielectric substrate holding the firstantenna in a spaced relationship relative to the second antenna. Thefirst EHF comm-link chip and first antenna may be configured as atransmitter that transmits electromagnetic radiation having a firstpolarization characteristic. The second EHF comm-link chip and thesecond antenna may be configured as a receiver that receiveselectromagnetic radiation having a second polarization characteristicthat is different than the first polarization characteristic.

Advantages of such systems and methods will be more readily understoodafter considering the drawings and the Detailed Description.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a simplified schematic overhead view of a first example ofan integrated circuit (IC) package including a die and antenna.

FIG. 2 shows a schematic side view of an exemplary communication deviceincluding an IC package and printed circuit board (PCB).

FIG. 3 shows an isometric view of another exemplary communication deviceincluding an IC package with external circuit conductors.

FIG. 4 shows a bottom view of the exemplary communication device of FIG.3.

FIG. 5 shows a side view of an illustrative portable storage card.

FIG. 6 shows a plan view of the portable storage card of FIG. 5.

FIG. 7 shows an illustrative arrangement of a portable device containingIC packages in EHF communication with a host device containingcorresponding IC packages.

FIG. 8 shows an isometric view of two illustrative boards with variousillustrative IC packages mounted thereon for communication between theboards.

FIG. 9 shows a side view of two illustrative mounted IC packagesarranged to communicate through a non-metalized window in an interveningplanar structure.

FIG. 10 is a block diagram describing an illustrative two-devicewireless docking system.

FIG. 11 is a block diagram describing another illustrative two-devicewireless docking system.

FIG. 12 shows an exploded view of an illustrative arrangement of an ICpackage and primary coil portion of an illustrative docking device.

FIG. 13 shows an assembled view of the docking device of FIG. 12.

FIG. 14 is an isometric view of two illustrative portable data storagedevices in a docking alignment.

FIG. 15 is a side view of two illustrative portable data storage devicesin a docking alignment.

FIG. 16 is a block diagram depicting an illustrative method for chargingand synchronizing data in a portable storage device.

FIG. 17 is an overhead view of an illustrative IC package with multipleantennas.

FIG. 18 is an overhead block diagram of an illustrative IC package withmultiple antennas arranged in a corner configuration.

FIG. 19 is an overhead view of an illustrative multi-antenna IC packagewith an illustrative via fence.

FIG. 20 is a cross-sectional side view of the IC package and via fenceof FIG. 18.

FIG. 21 is an isometric side view of an illustrative IC package with avia fence.

FIG. 22 shows two illustrative multi-antenna IC packages disposed oneabove the other.

FIG. 23 shows an illustrative arrangement of multiple single-antenna ICpackages.

FIG. 24 shows an illustrative array of multiple single-antenna ICpackages.

FIGS. 25-27 show illustrative arrangements of multiple single-antennachips in a single package.

FIG. 28 shows two illustrative devices each having two IC packages incommunication with each other.

FIG. 29 shows another example of two devices each having two IC packagesin communication with each other.

DETAILED DESCRIPTION OF THE DISCLOSURE

Wireless communication may be used to provide signal communicationsbetween components on a device or may provide communication betweendevices. Wireless communication provides an interface that is notsubject to mechanical and electrical degradation. Examples of systemsemploying wireless communication between chips are disclosed in U.S.Pat. No. 5,621,913 and U.S. Published Patent Application No.2010/0159829, the disclosures of which are incorporated herein byreference in their entirety for all purposes.

In one example, tightly-coupled transmitter/receiver pairs may bedeployed with a transmitter disposed at a terminal portion of a firstconduction path and a receiver disposed at a terminal portion of asecond conduction path. The transmitter and receiver may be disposed inclose proximity to each other depending on the strength of thetransmitted energy, and the first conduction path and the secondconduction path may be discontiguous with respect to each other. In someexamples, the transmitter and receiver may be disposed on separatecircuit carriers positioned with the antennas of thetransmitter/receiver pair in close proximity.

As discussed below, a transmitter and/or receiver may be configured asan IC package, in which one or more antennas may be positioned adjacentto a die and held in place by a dielectric or insulating encapsulationor bond material. An antenna may also be held in place by a lead framesubstrate. Examples of EHF antennas embedded in IC packages are shown inthe drawings and described below. Note that IC packages may also bereferred to as EHF IC packages or simply packages, and are examples ofwireless communication units that are also variously referred to as EHFcommunication units, communication units, communication devices,comm-link chip packages, and/or comm-link packages.

FIG. 1 shows an exemplary IC package, generally indicated at 10. ICpackage 10 includes a chip or die 12, a transducer 14 providingconversion between electrical and electromagnetic (EM) signals, andconductive connectors 16, such as bond wires 18, 20 electricallyconnecting the transducer to bond pads 22, 24 connected to a transmitteror receiver circuit included in die 12. IC package 10 further includesan encapsulating material 26 formed around at least a portion of the dieand/or the transducer. In this example encapsulating material 26 coversdie 12, conductive connectors 16, and transducer 14, and is shown inphantom lines so that details of the die and transducer may beillustrated in solid lines.

Die 12 includes any suitable structure configured as a miniaturizedcircuit on a suitable die substrate, and is functionally equivalent to acomponent also referred to as a chip or an integrated circuit (IC). Adie substrate may be any suitable semiconductor material; for example, adie substrate may be silicon. Die 12 may have a length and a widthdimension, each of which may be about 1.0 mm to about 2.0 mm, andpreferably about 1.2 mm to about 1.5 mm. Die 12 may be mounted withfurther electrical conductors 16, such as a lead frame, not shown inFIG. 1, providing connection to external circuits. A transformer 28,shown in dashed lines, may provide impedance matching between a circuiton die 12 and transducer 14.

Transducer 14 may be in the form of a folded dipole or loop antenna 30,may be configured to operate at radio frequencies such as in the EHFspectrum, and may be configured to transmit and/or receiveelectromagnetic signals. Antenna 30 is separate from but operativelyconnected to die 12 by suitable conductors 16, and is located adjacentto die 12.

The dimensions of antenna 30 are suitable for operation in the EHF bandof the electromagnetic frequency spectrum. In one example, a loopconfiguration of antenna 30 includes a 0.1 mm band of material, laid outin a loop 1.4 mm long and 0.53 mm wide, with a gap of 0.1 mm at themouth of the loop, and with the edge of the loop approximately 0.2 mmfrom the edge of die 12.

Encapsulating material 26 is used to assist in holding the variouscomponents of IC package 10 in fixed relative positions. Encapsulatingmaterial 26 may be any suitable material configured to provideelectrical insulation and physical protection for the electrical andelectronic components of IC package 10. For example, encapsulatingmaterial 26, also referred to as insulating material, may be a moldcompound, glass, plastic, or ceramic. Encapsulating material 26 may alsobe formed in any suitable shape. For example, encapsulating material 26may be in the form of a rectangular block, encapsulating all componentsof IC package 10 except the unconnected ends of conductors 16 connectingthe die to external circuits. External connections may be formed withother circuits or components.

FIG. 2 shows a representational side view of a communication device 50including an IC package 52 flip-mounted to an exemplary printed circuitboard (PCB) 54. In this example, it may be seen that IC package 52includes a die 56, a ground plane 57, an antenna 58, bond wires,including bond wire 60, connecting the die to the antenna. The die,antenna, and bond wires are mounted on a package substrate 62 andencapsulated in encapsulating material 64. Ground plane 57 may bemounted to a lower surface of die 56, and may be any suitable structureconfigured to provide an electrical ground for the die. PCB 54 mayinclude a top dielectric layer 66 having a major face or surface 68. ICpackage 52 is flip-mounted to surface 68 with flip-mounting bumps 70attached to a metallization pattern (not shown).

PCB 54 may further include a layer 72 spaced from surface 68 made ofconductive material forming a ground plane within PCB 54. The PCB groundplane may be any suitable structure configured to provide an electricalground to circuits and components on PCB 54.

FIGS. 3 and 4 illustrate another exemplary communication device 80including an IC package 82 with external circuit conductors 84 and 86.In this example, IC package 82 may include a die 88, a lead frame 90,conductive connectors 92 in the form of bond wires, an antenna 94,encapsulating material 96, and other components not shown to simplifythe illustration. Die 88 may be mounted in electrical communication withlead frame 90, which may be any suitable arrangement of electricalconductors or leads 98 configured to allow one or more other circuits tooperatively connect with die 90. Antenna 94 may be constructed as a partof the manufacturing process that produces lead frame 90.

Leads 98 may be embedded or fixed in a lead frame substrate 100, shownin phantom lines, corresponding to package substrate 62. The lead framesubstrate may be any suitable insulating material configured tosubstantially hold leads 98 in a predetermined arrangement. Electricalcommunication between die 88 and leads 98 of lead frame 90 may beaccomplished by any suitable method using conductive connectors 92. Asmentioned, conductive connectors 92 may include bond wires thatelectrically connect terminals on a circuit of die 88 with correspondinglead conductors 98. For example, a conductor or lead 98 may include aplated lead 102 formed on an upper surface of lead frame substrate 100,a via 104 extending through the substrate, a flip-mounting bump 106mounting IC package 82 to a circuit on a base substrate, such as a PCB,not shown. The circuit on the base substrate may include a externalconductors, such as external conductor 84, which for example, mayinclude a strip conductor 108 connecting bump 106 to a further via 110extending through the base substrate. Other vias 112 may extend throughthe lead frame substrate 100 and there may be additional vias 114extending through the base substrate.

In another example, die 88 may be inverted and conductive connectors 92may include bumps, or die solder balls, as described previously, whichmay be configured to electrically connect points on a circuit of die 88directly to corresponding leads 98 in what is commonly known as a “flipchip” arrangement.

A first and a second IC package 10 may be co-located on a single PCB andmay provide intra-PCB communication. In other examples, a first ICpackage 10 may be located on a first PCB and a second IC package 10 maybe located on a second PCB and may therefore provide inter-PCBcommunication. One such PCB may be part of a data storage device, whichincludes any device that has data storage capability. A data storagedevice may also be portable.

For example, FIGS. 5 and 6 show an illustrative wallet card-sizedportable storage device 120, which may include multiple examples of ICpackage 10 such as IC packages 122, memory chips 124, controller chips126, and/or power source 128 all mounted in a preselected array on adielectric substrate or expanse 130 within portable storage device 120.

A data storage device (such as portable storage device 120) may includea data storage unit, which in turn may include one or more memorydevices such as are embodied in memory chip 124, and may includeassociated memory support circuitry, such as a controller embodied in acontroller chip 126. Components such as memory chips 124, controllerchips 126, and inductive or contactless power source 128 may beconventional components of the kind typically found in “smart cards” andthe like. Wireless communication circuits, such as IC packages 122, maybe disposed alongside and in electrical communication with thesecomponents and configured to provide communication between the variouscomponents. In other examples, the chips of IC packages 122 may beembedded within memory chips 124 and/or controller chips 126, such asbeing mounted within the packaging of those components. Each memory chipmay be associated with a respective one of the communication circuits,and there may be communication circuits not associated with a memorychip, as is appropriate for a particular application. Power source 128may include, for example an inductive coil 131 and a power interfacecircuit 133.

Dielectric substrate or expanse 130 may have a major surface andmultiple edges forming a perimeter. The multiple IC packages 122 may bespaced around and from the perimeter of dielectric substrate or expanse130, and may be configured to provide communication between componentson the card, such as between memory chips 124. IC packages 122 may alsobe configured to provide communication between portable storage device120 and a host device 132 configured with one or more corresponding ICpackages 134, as shown in FIG. 7. A portable storage device may also bereferred to as a client device, especially in relation to a host device.Host and client may communicate best in a certain mutual configuration,such as by placing the devices with major surfaces of the client andhost facing each other with the wireless communication devices insuitable alignment to effect intercommunication.

A covering 136 may be used to seal and/or encase the components of adata storage device or card 120. Covering 136 may accommodateelectromagnetic (EM) communication by being made of a dielectricmaterial or other material substantially transparent to EM radiation inthe EHF range. Similarly, a covering 138 may cover components of a hostdevice 132.

Host devices 132 are any devices having a transducer capable ofcommunicating with one or more IC packages 122 on a data storage device(such as device 120), and may include devices such as a personalcomputer, phone, camera, ATM, or electronic point of sale device (notpictured). In this manner, high-bandwidth EHF communications may beachieved within a sealed, rugged device and high-rate data transfer maybe accomplished with a host machine via a zero-insertion force,non-corroding, non-wearing interface. Furthermore, relaxed alignmenttolerances and improved signal integrity at smaller sizes provideimproved manufacturability and portability.

FIGS. 8 and 9 illustrate a high-bandwidth scalable architecture forportable storage devices and memory modules using multiple communicationIC packages mounted on a plurality of PCBs. In some examples, ICpackages 140 may be configured to communicate directionally orhemispherically. A pair of IC packages, such as IC packages 142 and 144,may be disposed facing each other on separate PCBs, such as on PCB 146and PCB 148 shown in FIG. 8. IC package 142 may be configured to radiateor receive EHF signals in the direction of IC package 144, and/or viceversa, thereby providing a link to allow EHF communication between ICpackage 142 and IC package 144.

Using a stacked-PCB configuration with IC packages communicating betweenstack “layers” in this fashion provides a scalable architecture whichallows significant communication and capacity growth without changingthe footprint of a device. Multiple layers having inter-layercommunication may be provided. It may also be observed that, due to therelatively broad radiation pattern transmitted by an IC package, PCBs146 and 148 can be misaligned to some extent on the X, Y, and/or Z axiswithout substantially affecting a communication link between ICpackages.

In some examples, a related method and configuration may be used toprovide architectural flexibility as shown in FIG. 9. Because paired ICpackages do not require physical connection to effect communication, oneor more non-conductive windows 150 may be configured in an interveninglayer, such as conductive layer 152, to allow communication between ICpackages, such as IC packages 154 and 156, on nonadjacent layers of acommunication assembly 158. Window 150 may be configured as a hole orgap in intervening layer 152. In other examples, because dielectricmaterial is essentially transparent to EHF radiation, window 150 may beconfigured as an area in layer 152 that is free of metal components butdoes still contain materials such as dielectric lamination layers. Thismethod of construction allows improved scalability and flexibility indesigning stacked device architectures. It will be appreciated that theassembly may comprise separate devices 160 and 162 containing ICpackages 154 and 156 mounted to respective PCBs 164 and 166. As afurther example, layer 152 may be a part of either of PCBs 164 and 166.In yet a further example, layer 152 and IC packages 154 and 156 may bemounted in a single PCB assembly 168.

A wireless docking system incorporating the previously discussed ICpackages will now be described. A wireless docking system may enableconnector-free docking of a portable device on a base station, and mayprovide simultaneous wireless data transfer and wireless charging.

FIG. 10 is a block diagram depicting an example of a wireless dockingsystem 200. Wireless docking system 200 may include a portable device202 and a base unit 204. Portable device 202 may be any deviceconfigured to be powered wirelessly using an inductive power system andalso to communicate wirelessly using one or more wireless communicationunits, such as IC packages. Portable device 202 may include an EHFcommunication circuit 208, a data storage unit 210, a local powerstorage device 212, and/or an inductive power receiver 214. Thecomponents of portable device 202 may be contained in a case (notpictured). A portable device 202 may also be a portable media device,which may, for example, take the form of a cellular phone, personaldigital assistant (PDA), MP3 player, notebook computer, or tablet.

EHF communication circuit 208 may be any circuit configured tocommunicate wirelessly using one or more IC packages or communicationunits. For example, EHF communication circuit 208 may include two ICpackages, one configured as a transmitter and the other configured as areceiver. These IC packages may be configured to communicate with otherIC packages in other devices rather than with other such packages in thesame device.

EHF communication circuit 208 may be in electrical communication withdigital data storage unit 210. Data storage unit 210 may be any suitabledata storage unit capable of reading and writing data. For example, datastorage unit 210 may be an IC chip, card, disk, or solid-state drive(SSD). In typical operation, EHF communication circuit 208 may functionto transfer data between data storage unit 210 and an external device.

EHF communication circuit 208 may also receive power from local powerstorage device 212. Power storage device 212 may be any suitable deviceconfigured to store electrical energy for future use. For example, powerstorage device 212 may be a lithium ion battery, a fuel cell, acapacitor such as an ultracapacitor, or any other battery-like devicethat may be charged and discharged.

Inductive power receiver 214 may be in electrical communication withlocal power storage device 212 and may function to charge power storagedevice 212. Inductive power receiver 214 may be any suitable devicecapable of receiving wireless energy transfer from a power source. Forexample, inductive power receiver 214 may include a secondary coil 220in which a current may be induced by a primary coil 222 located in aseparate charging device such as base unit 204. Worldwide open standardsfor this sort of inductive charging have been developed. For example the“Qi” standard developed by the Wireless Power Consortium has begun to beutilized in commercial products.

Base unit 204 may be any suitable device configured to wirelesslycommunicate with portable device 202 and to wirelessly provide power toportable device 202. For example, base unit 204 may include a housingthat encloses an inductive power source 224, a host controller 226,and/or an EHF communications circuit 228. Note that in some examples, atleast some roles of the two devices may be reversed. Accordingly, hostcontroller 226 may be located in portable device 202 and base unit 204may include a storage unit such as storage unit 210. In otherembodiments, both devices may include an example of a host controller226 and/or a storage unit 210, enabling functionality such asdevice-to-device data copying.

Inductive power source 224 may be any suitable device configured toprovide electrical power wirelessly to inductive power receiver 214. Asdescribed above, inductive power source 224 may include primary coil222.

Host controller 226 may be any suitable device or component configuredto control the electronic activity of the overall wireless dockingsystem 200. For example, host controller 226 may be a personal computingdevice configured via software and/or firmware to coordinatesynchronization of data between portable device 202 and a personalcomputer. In other examples, host controller 226 may include any or allof the following: a video player; audio player; security system; displaysystem; music, video, and/or audiobook organizer; data back-up storagesystem; portable phone manager; etc.

As mentioned before, host controller 226 may be included in portabledevice 202 rather than base unit 204. For example, portable device 202may control a transaction wherein a video playing or available onportable device 202 may appear on a base unit 204 that comprises a largescreen video display. This transaction may be controlled entirely fromthe portable device.

Base unit 204 may also include EHF communications circuit 228, which mayinclude one or more IC packages or other communications units configuredto transfer information to and from the IC packages in portable device202. For each IC package configured as a transmitter in portable device202, a corresponding IC package configured as a receiver may be providedin base unit 204. In similar fashion, a receiver in portable device 202may have a corresponding transmitter in base unit 204. To facilitatedata transfer, the resulting transmitter-receiver pairs may be disposedsuch that proper general alignment of the devices also aligns alltransmitter-receiver pairs.

Alternatively, some transmitter-receiver pairs may be aligned when theportable device and base station are placed in a first configurationwhile others may be aligned when the two devices are placed in a secondconfiguration. For example, a base unit 204 may provide two sets ofmarkings on an interface surface. One set of markings may indicate whereto place portable device 202 to enable data synchronization, while theother may indicate where to place portable device 202 to enable musicplayback or some other functionality, and both positions may allowsimultaneous battery charging.

FIG. 11 is a block diagram depicting an example of a wireless dockingsystem 300, with a portable device 302 having an EHF communicationcircuit 308, a digital storage device 310, local power storage 312, andan inductive power receiver 314, all similar to portable storage device202 in wireless docking system 200. A base unit 304 may include an EHFcommunication circuit 328 and an inductive power source 324, againsimilar to base unit 204 of system 200. In wireless docking system 300,however, portable device 302 may include a host/device controller 316and base unit 304 also may include a host controller 326. As describedabove, this arrangement enables additional functionality. In otherexamples, two portable devices may be used to accomplish data transferor copying. In that case, the portable devices may rely on local powerstorage, such as one or more batteries, rather than inductive power.

FIGS. 12 and 13 depict portions of an illustrative base unit 400 similarto base unit 204 and base unit 304. In this example, a primary coil 402is disposed on a mounting surface 404, with an IC package 406 beingco-located on surface 404 surrounded by primary coil 402 andelectrically connected to an EHF communication circuit (not shown).Primary coil 402 and IC package 406 may be encapsulated in plastic oranother dielectric, which may take the form of a cylindrical block 408.Block 408 may also take any other suitable shape. A dielectric blockhaving a substantially planar upper surface secures the coil and ICpackage while also providing a stable surface for secure positioning ofportable devices. In other examples, markings may be provided on theupper surface of block 408 and/or form-fitting recesses may be providedto facilitate placement of portable devices such as portable device 202or 302.

FIG. 14 is a perspective view and FIG. 15 is a side view of portions oftwo illustrative portable data storage devices 420 and 420′ in a dockingalignment. Devices 420 and 420′ are examples similar to portable devices202 and 302 previously described. As explained above, two datastorage-enabled portable devices may be configured to accomplish directdrive-to-drive docking. Here, first device 420 includes data storageunits 422 and at least one IC package 424. Second device 420′ hassimilar components, indicated by corresponding primed referencenumerals. In this example, two IC packages are used in each device, withone IC package configured as a transmitter and the other configured as areceiver. In other examples, a single IC package may instead beconfigured as a transceiver.

Power may be provided in each device by a power storage device, such asa battery 426 (426′) rechargeable by inductive power receiver 428(428′), which includes a secondary coil 430 (430′). As describedearlier, a docking station or base unit may be used to provide inductivepower. When docking from portable device to portable device, componentson each device are powered by the respective battery. In other examples,an ultracapacitor or other power storage device may be used.

FIG. 16 shows a method 450 for charging a portable storage device andsynchronizing data between the portable storage device and a hostdevice, base station, or docking station. A step 452 of method 450 mayinclude aligning a portable device such as portable device 202 or 302 onor in mechanical contact with a docking surface of a docking stationsuch as base station 204 or 304 or 400, such that EHF communicationunits of the respective portable device and base station are inproximity sufficient to allow communication. A step 454 of method 450may include powering by the inductive power source in the base stationthe inductive power receiver in the portable device, thereby chargingthe power storage device and providing power from the power storagedevice to the data storage unit and EHF IC package in the portabledevice. Note that the power storage unit may, for example, include abattery or an ultracapacitor.

A step 456 of method 450 may include electromagnetically transferringdata between a digital circuit in the base station and one or more datastorage units in the portable device by transferring data between thedigital circuit and a host EHF communication unit, transferringelectromagnetic signals between the host EHF communication unit and theclient EHF communication unit, and transferring data between the clientEHF communication unit and data storage unit. An optional step 458 ofmethod 450 may include outputting an audio or video signal on an outputdevice operatively coupled to the data storage unit of the portabledevice. The audio or video signal may be either a digital signal or ananalog signal, as appropriate for the output device. Another optionalstep 460 of method 450 may include controlling operation of the digitalcircuit in the host/base station by a host controller included in theportable device. Another optional step 462 of method 452 may include twoEHF communication units in each of the portable device and the basestation, one configured as a transmitter and the other as a receiver,such that information may be concurrently passed in both directionsbetween the portable device and the base station via coupledtransmitter/receiver pairs.

A single IC package 10 may be configured as a transceiver 500 byconnecting a respective antenna to both the transmitter circuit and thereceiver circuit on die 12. FIG. 17 is an overhead view of anillustrative IC package 502 including a die 504 with multiple antennas.Multi-antenna IC package 502 includes both a transmitter circuit and areceiver circuit, and furthermore includes a first antenna 506operatively connected to the transmitter circuit and a second antenna508 operatively connected to the receiver circuit. It should beappreciated that the first antenna may instead be connected to thereceiver circuit and the second antenna may instead be connected to thetransmitter circuit. First antenna 506 and second antenna 508 areexamples of transducer 14, and may be held in a spaced relationship withdie 504 by encapsulating material 510, in similar fashion to theconstruction of a single-antenna IC package 10.

First antenna 506 and second antenna 508 may be dipole or folded dipoleantennas oriented orthogonally to one another to take advantage of thepolarization of the EHF signals being communicated. Orthogonal signalsmay have reduced interference as compared to the interaction of signalsproduced by antennas disposed at other angles. This phenomenon resultsfrom the fact that a dipole antenna on an EHF comm-link chip produceslinearly polarized EM radiation. Accordingly, locating the two antennason adjacent sides of rectangular die 504 allows exploitation of thisaspect of the signals.

While antennas are shown in FIG. 17 as located at ports along either thewidth or the length of die 504, antennas 606 and 608 may also be locatednear or at two corners of a die 604, as depicted in the exemplarymulti-antenna package 602 of FIG. 18, in which case they are disposedproximate to opposite corners to provide increased spatial separation.However, in order to achieve improved results with antennas in thisconfiguration relative to die 604, it was discovered that a packageground plane 609 may be made larger relative to the die. Additionally,die 604 may be offset relative to ground plane 609 in such a way thatthe antennas are centered along respective package edges and alongrespective ground plane sides as shown in FIG. 18.

In other examples, similar to those discussed further below with respectto FIGS. 22-26, EHF antennas associated with IC packages may includeother suitable antennas in order to take advantage of other polarizationmethods. For example, circular or elliptical polarization may be left-or right-handed, resulting in reduced interference between left- andright-hand polarized EM waves regardless of orientation when adjacentantennas are driven with opposing polarizations. Note that circularpolarization is a specific case of elliptical polarization. Othersuitable antennas producing linear, circular, or elliptical polarizationmay include spiral, patch, and/or triangular antennas.

While orthogonal orientation may reduce interference between dipoleantennas 506 and 508, the quality of communication with a second devicebenefits from some lateral spatial separation of the two antennas inorder to further reduce interference when the two devices communicateconcurrently. This distance may be varied by changing the size of thedie and thereby the associated spacing of the antennas. Specifically,with the antennas disposed near the middle of respective sides of thedie, a larger die results in greater separation between the antennas.Spacing may also be altered by adjusting the positions of the antennasalong the sides of the die, as in FIG. 18.

It was also discovered that mounting multi-antenna die 504 on asubstrate 512 in the chip package 502 produces a radiation-propagationpath between the first and second antennas through the substrate itself.For example, with the antennas positioned on adjacent sides of the die,a propagation path extending through the substrate around the corner ofthe die between the antennas is produced. In order to reduce thestrength of the radiation propagating along the propagation path throughthe substrate, an EHF blocking structure 610 may be constructed in thepropagation path.

An example of such a structure is depicted in FIGS. 19-21. As depicted,a via fence 700 may be created by forming plated vias 702 throughsubstrate 704 in a line across the propagation path between antennas 710and 712 of an IC package 714 and die 716. A strip of conductive material706 may be laid down on an upper surface of the substrate, and the vias702 may electrically connect conductive strip 706 and an underlyingpackage ground plane 708. In some examples, a plurality of vias 702 maybe formed as closely spaced as practicable, and preferably at a spacingwell below the wavelength of a circuit operating frequency.

FIG. 22 shows first and second multi-antenna IC packages 720 and 720′mounted respectively on exemplary devices 721 and 721′, arranged oneover the other to show how the packages may be configured to enablecommunication between devices or systems. As shown in FIG. 22, thepackages may be configured such that a transmitter antenna 722 on device721 is aligned with a receiver antenna 724′ on device 721′, and areceiver antenna 724 on device 721 is aligned with a transmitter antenna722′ on device 721′ when the two devices are in lateral and proximalalignment. This arrangement may allow simultaneous transmission andreception between the two devices, with the packages acting astransceivers.

Various other arrangements have been discovered in which multipleantennas may be employed for simultaneous transmission and/or receptionon one or more communication channels. Examples of these arrangementsare now described in further detail.

FIG. 23 shows an example of two discrete IC packages with associatedantennas mounted on a common PCB. Specifically, FIG. 23 illustrates aPCB 730 having mounted thereon discrete IC packages 732 and 734 withantennas 736 and 738 that are disposed orthogonally. In the example ofFIG. 23, and in the examples of FIGS. 23-26 generally, the antennas ofeach chip may be dipole or folded dipole, and therefore linearlypolarized, or may instead be antennas having other polarizations such ascircular or elliptical.

Increased densities of larger N×M arrays of IC packages or chips mayalso be achieved, such as a 5×5 array 740 depicted in FIG. 24, by takingadvantage of the polarization characteristics of emitted EHF signals. Inthis example, the EHF signal of each antenna 742 has a linearpolarization direction vector pointing from the antenna directly awayfrom the chip. A plurality of IC packages 744 may be arranged such thatno two adjacent IC packages 744 have their polarization directionvectors aligned with each other, as indicated by the differentorientations of antennas 742. For example, each IC package 744 in FIG.24 has a polarization direction vector oriented at 90-degrees from thepolarization direction vector of each adjacent IC package 744. Anothercorresponding array of IC packages with corresponding orientations (notshown) may be disposed on another layer of a stacked architecture toprovide inter-layer communications, also with adjacent antennas havingdifferent polarization characteristics.

Rather than arranging multiple single-antenna packages on a mountingsurface, it is also possible to achieve multi-channel communications byplacing multiple single-antenna dies or chips inside a single commonpackage encapsulant. FIGS. 25-27 show examples of these types ofdevices.

FIGS. 25-27 illustrate various arrangements of multiple single-antennachips in a common package encapsulant. These arrangements may be used toallow simultaneous transmission and reception on one or more channels.As shown in the drawings, antennas are either oriented orthogonally fromother proximal antennas or are in a parallel orientation and spacedapart within a given package in order to take advantage of the linearpolarization effect described above, in addition to spatial separation.As mentioned above, these embodiments may use different ellipticalpolarization in adjacent antennas to achieve similar isolation betweenadjacent communication channels.

Specifically, FIG. 25 illustrates an IC package 750 having adjacentdiscrete chips 752 and 754 with antennas that are disposed orthogonally.

FIG. 26 illustrates an elongate chip package 760 having discrete chips762, 764, 766, with chip 764 disposed adjacent to and between chips 762and 766. The antenna of chip 764 is disposed orthogonally to theantennas of chips 762 and 766, the antennas of which are accordinglydisposed parallel to each other in this two dimensional array. In athree-dimensional array, all three antennas may be positionedorthogonally to each other.

FIG. 27 illustrates an IC package 770 having discrete chips 772, 774,776, 778, with the chips distributed around the periphery of thepackage. More specifically, the package is rectangular and each chip isdisposed proximate a package corner. Each chip is adjacent to two otherchips, such as chips 774 and 778, and disposed opposite the third chip,such as the antenna of chip 772 being parallel to but spaced from chip776 compared to the spacing between the antennas of adjacent chips 772and 774. The antenna of each chip, such as chip 772, is orthogonal tothe antennas of the two adjacent chips, such as chips 774 and 778, andis parallel to but spaced from the antenna of the opposite chip, such aschip 776. In a three-dimensional configuration, the antennas of oppositechips may also be orthogonal in addition to being orthogonal to theantennas of the adjacent chips.

As mentioned above, circular- and elliptically-polarized signals may beleft- or right-handed. Interference between a left-handed and aright-handed signal is reduced regardless of orientation of the antennascompared to signals having the same polarization. However, spatialseparation may still reduce interference. Accordingly, the examples ofFIG. 23-27 may include antenna types that are linear, elliptical, orcircular in their polarization. For linear-polarized antennas, thespatial separation as well as the orthogonal or opposite polarizationshown in the drawings may reduce signal interference. For circular- orelliptically-polarized antennas, orthogonal orientation is not a factorin signal interference, but spacing remains a factor. Accordingly, thearrangements shown in FIGS. 23-27 are suitable for a variety of antennatypes.

FIGS. 28 and 29 depict two specific embodiments of systems including atwo-chip device or package in communication with another two-chip deviceor package. In the examples of FIGS. 28 and 29, all IC packages havedipole or folded dipole antennas. As shown in the example of FIG. 28, acommunication system 800 includes a first device 802 having two mountedsingle-chip, single-antenna IC packages 804 and 806, and a second device808 having two mounted single-chip, single-antenna IC packages 810 and812.

In device 802, the antennas of packages 804 and 806 are each disposedorthogonally and mutually spaced away from the other along a common sideof the device. The antennas of IC packages 810 and 812 are alsoorthogonal and disposed apart along a common side of device 808 so thateach antenna is aligned with and proximate an antenna of one of ICpackages 804 and 806 when the respective common sides of devices 802 and808 are disposed in facing relationship, as depicted.

Specifically, when configured and positioned as shown, the antenna of ICpackage 804 is directed toward and proximate to the antenna of ICpackage 810, and the antenna of IC package 806 is directed toward andproximate to the antenna of IC package 812. Described in another way, ifan antenna end of each chip is defined as the end including the antenna,and an opposite end is defined as the end opposite the antenna end, thenorienting two IC packages 804 and 806 of device 802 with their oppositeends closer together as in FIG. 28 results in the antenna ends beingdirected away from each other into respective spaced-apart radiationregions. Second device 808 then has two corresponding packages 810 and812 spaced significantly farther apart so that when the common sides ofthe two devices are positioned facing each other, the associated antennaends of the device 804 packages are facing the corresponding antennaends of the device 802 packages. More specifically, the antenna end ofpackage 804 faces the antenna end of package 810 and the antenna end ofpackage 806 faces the antenna end of package 812.

In other examples of system 800, first and second devices 802 and 808are instead IC packages, and IC packages 804, 806, 808, and 810 arechips with respective antennas. A similar alternative is possibleregarding the following example.

A communication system 900 depicted in FIG. 29 includes a first two-chipdevice 902 having IC packages 904 and 906, and a second two-chip device908 having IC packages 910 and 912. In this example, the antennas of thetwo packages are orthogonal to each other and the antenna ends of thepackages are disposed adjacent to each other along a common side of therespective device. The respective opposite ends of the IC packages oneach device are spaced farther apart than the respective antenna ends.

When devices 902 and 908 are placed with the common sides in proximity,the four antennas face a common radiation region 914 disposed betweenthe respective antennas with opposite antennas, with the antennas of ICpackages 904 and 910 and the antennas of IC packages 906 and 912, beingparallel. Each antenna is also orthogonal to the two adjacent antennas.For example, the antenna of IC package 904 is orthogonal to the antennasof IC packages 906 and 910.

This arrangement allows two substantially identical devices tocommunicate as shown in FIG. 29, by taking advantage of the linearpolarization effect. Although the paths of radiation intersect in theradiation region, interference is minimized by the previously describedpolarization differences.

Accordingly, a system as described above for scalable, high-bandwidthconnectivity may include one or more of the following examples.

In one example, an electronic device may include a dielectric clientsubstrate, a first data storage unit mounted to the client substrate forstoring digital information, and a first client EHF communication unithaving a first antenna. The first client communication unit mounted tothe client substrate may be in communication with the first data storageunit. This may facilitate converting between an EHF electromagneticsignal containing digital information conducted by the first antenna anda data signal conducted by the first data-storage circuit.

A second data storage unit may be mounted to the client substrate and incommunication with the first client EHF communication unit. The firstand second data storage units may be formed as integrated circuits.

A second data storage unit may be mounted to the client substrate. Theelectronic device may also include a second client EHF communicationunit mounted to the client substrate in communication with the seconddata storage unit and having a second antenna.

The first client EHF communication unit may be configured as atransceiver.

The electronic device may also include a plurality of data storage unitsincluding the first data storage unit and a plurality of client EHFcommunication units including the first client EHF communication unit.The pluralities of data storage units and client communications unitsmay be mounted to the client substrate and distributed on a majorsurface of the client substrate spaced from a perimeter of the majorsurface.

The client EHF communication units may transmit or receive predominantlyelectromagnetic radiation having a polarization characteristic and thecommunication units may be oriented with adjacent communication unitshaving different respective polarization characteristics.

The plurality of client EHF communication units may be distributed in atwo dimensional pattern, there being at least one client EHFcommunication unit having an adjacent client EHF communication unitdisposed in each of two non-parallel directions.

The plurality of client EHF communication units may be distributed in anN×M array, where N and M are integers greater than 1.

A data storage system may include the electronic device and a hostdevice. The host device may include a first host EHF communication unitfor communicating the EHF electromagnetic signal with the first clientEHF communication unit in order to convey digital information betweenthe host device and the electronic device.

The electronic device may further include a plurality of client EHFcommunication units including the first client EHF communication unit,and a data storage unit associated with and operatively coupled to oneof the plurality of client EHF communication units. The data storageunit and client EHF communication units may be mounted to the clientsubstrate and distributed on a major surface of the client substratespaced from a perimeter of the major surface of the client substrate.The host device may also have a dielectric host substrate and aplurality of host EHF communication units including the first host EHFcommunication unit, with each host EHF communication unit correspondingto a respective one of the plurality of client EHF communication units.The host EHF communication units may be mounted to and distributed on amajor surface of the host substrate in positions appropriate for thehost communications units to align sufficiently with correspondingrespective ones of the plurality of client EHF communication units whenthe major surface of the client substrate is positioned facing the majorsurface of the host substrate. This may facilitate communication betweenthe host EHF communication units and the client EHF communication units.

The client EHF communication units and the host EHF communication unitsmay transmit or receive electromagnetic radiation having a polarizationcharacteristic and the communication units may be oriented with adjacentcommunication units having different polarization characteristics, witheach pair of aligned host and client EHF communication units having thesame polarization characteristic.

In another example, an IC package assembly may have first, second, andintermediate dielectric substrate portions. A first EHF comm-link chipmay be mounted to the first dielectric substrate portion, with a firstantenna mounted to the first dielectric substrate portion andoperatively coupled to the first EHF comm-link chip. A second EHFcomm-link chip may be mounted to the second dielectric substrateportion, and a second antenna mounted to the second substrate portionand operatively coupled to the second EHF comm-link chip. The first EHFcomm-link chip and the first antenna may be configured as a transmitter.The second EHF comm-link chip and the second antenna may be configuredas a receiver. The second antenna may be disposed relative to the firstantenna to receive radiation transmitted by the first antenna. Theintermediate dielectric substrate portion may extend between the firstand second antennas.

The IC package may also include a conductive plane having an aperture,the conductive plane being disposed between the first and seconddielectric substrate portions. The intermediate dielectric portion maybe disposed in the aperture.

In another example, a data device for electromagnetic communication witha host may include at least one data storage unit and at least one EHFcommunication unit in communication with the at least one data storageunit. The EHF communication unit may be constructed to communicate withthe host via electromagnetic communication. The at least one datastorage unit and the at least one EHF communication unit may be coupledto an expanse.

The data device may also include a covering of dielectric material thatseals the at least one data storage unit, the at least one EHFcommunication unit, and the expanse.

The expanse may include a printed circuit board (PCB), and the at leastone EHF communication unit may be coupled to the PCB.

The data device may also include plural data storage units formed asintegrated circuits (ICs) mounted on the PCB, and plural EHFcommunication units also mounted on the PCB relative to the data storageunits. The data storage units and EHF communication units may bearranged on the PCB in a preselected array, and the EHF communicationunits may each be positioned on the PCB in a preselected orientation inwhich signals generated by each EHF communication unit have apolarization characteristic that is oriented differently from apolarization characteristic of adjacent EHF communication units.

In a further example, a data card for electromagnetic communication witha host may comprise a card body that includes an outer surface and aninternal expanse. The internal expanse may include plural data storageunits. The body may accommodate communication with the host viaelectromagnetic communication. The internal expanse may also include aplurality of EHF communication units that are each in communication withat least one of the data storage units. The internal expanse may includea printed circuit board (PCB), and the data storage units and the EHFcommunication units may be coupled to the PCB. The EHF communicationunits may be located on the PCB relative to the data storage units. TheEHF communication units and data storage units may also be arranged onthe PCB in a preselected array, with EHF communication units eachpositioned on the PCB in a preselected orientation in which signalsgenerated by each EHF communication unit have a polarizationcharacteristic that is different from that of adjacent EHF communicationunits.

In another example, a system for communicating EHF electromagneticsignals between a first and a second communication apparatus may includea first communication apparatus. The first communication apparatus mayinclude a printed circuit board (PCB) and a first EHF communication unitdisposed on the PCB. The first EHF communication unit may include a chiphaving an integrated circuit (IC), an antenna in communication with theIC, and insulating material holding the IC and antenna in fixedpositions on the PCB. The IC may be operatively coupled to the antennaand may contain at least one of a transmitter circuit that transforms abaseband data signal into an EHF electrical signal and conducts thetransformed EHF electrical signal to the antenna for transmission as anEHF electromagnetic signal encoded with data, and a receiver circuitthat receives from the antenna an EHF electrical signal received by theantenna as an EHF electromagnetic signal encoded with data andtransforms the received EHF electrical signal into a baseband datasignal. The first communication apparatus may also include a datastorage unit supported by the PCB for storing data and communicating thebaseband data signal with the EHF communication unit. The firstcommunication apparatus may also include an inductive power receiver forconverting received inductive energy into power for operating the firstEHF communication unit and data storage unit.

The second communication apparatus may include a power source configuredto produce the inductive energy for the inductive power receiver, and asecond EHF communication unit for communicating the EHF electromagneticsignal with the first EHF communication unit.

The first communication apparatus may also include a power storagedevice coupled to the inductive power receiver for storing powerreceived from the inductive power receiver and applying the stored powerto the first EHF communication unit and the data storage unit. The firstcommunication apparatus may also include a portable data storage deviceand the second communication apparatus may also include a dockingstation for supporting the first communication apparatus with the firstEHF communication unit in proximity to the second EHF communicationunit.

The first EHF communication unit may also include a lead frame couplingthe IC to conductors printed on the PCB, and the IC may include a groundplane operatively connected to a first conductor element in the leadframe. The insulating material of the first EHF communication unit mayencapsulate the IC, the lead frame, and the antenna to comprise an ICpackage.

In another example, a system for wirelessly transferring data and powermay include a client communication apparatus. The client communicationapparatus may include a client data circuit, a client EHF communicationunit, and a client inductive power coil. The client data circuit may beconfigured for processing data. The client EHF communication unit may becoupled to the client data circuit in order to communicate data in afirst data signal conducted between the client EHF communication unitand the client data circuit. The client inductive power coil may convertreceived inductive energy into power for operating the client EHFcommunication unit and the client data circuit. The system may alsoinclude a host communication apparatus including a host data circuit, ahost EHF communication unit, and a power source. The host data circuitmay process data. The host EHF communication unit may be coupled to thehost data circuit in order to communicate data in a second data signalconducted between the host EHF electromagnetic communication unit andthe host data circuit. The host EHF communication unit may communicateelectromagnetically with the client EHF communication unit. The powersource may provide inductive energy to the client inductive power coilwhen the client communication apparatus is positioned in proximity tothe host communication apparatus.

The client communication apparatus may further include a power storagedevice coupled to the power coil for storing power received by the powercoil and may apply the stored power to the client EHF comm.-link chipassembly and the client data circuit.

The host communication apparatus may further include a host controllerin communication with the host EHF communication unit for controllingoperation of the host EHF comm-link chip.

The power source may include a host inductive power coil for generatingthe inductive energy. The host communication apparatus may also includea plastic encapsulant holding the host inductive power coil in a fixedposition relative to the host EHF communication unit.

An exemplary method of charging and synchronizing data in a portabledevice containing data storage may include providing a portable deviceincluding a data storage unit, a first EHF communication unit incommunication with the data storage unit, a power storage device, and aninductive power receiver configured to provide power to the powerstorage device. A docking station may also be provided, including ahousing having a size and shape for supporting the portable storagedevice, a second EHF communication unit, a digital circuit, and a powersource. The portable device may be placed on the docking station withthe first EHF communication unit in proximity with the second EHFcommunication unit and the power source in proximity with the inductivepower receiver. Placing the devices in proximity may power by the powersource the inductive power receiver in the portable device, therebycharging the power storage device and providing power from the powerstorage device to the data storage unit and the first EHF communicationunit. Data may be electromagnetically transferred between the digitalcircuit and the data storage unit by transferring data between thedigital circuit and the first EHF communication unit, transferringelectromagnetic signals between the first EHF communication unit and thesecond EHF communication unit, and transferring data between the secondEHF communication unit and the data storage unit.

An analog or digital audio or video signal may be output on an outputdevice operatively coupled to the data storage unit.

Operation of the digital circuit may be controlled by a host controllerincluded in the portable device.

The power storage device may be a rechargeable battery or a capacitorthat may be charged by powering the inductive power receiver using thepower source.

The portable device may include a third EHF communication unit and thedocking station may include a fourth EHF communication unit.Electromagnetic radiation may be transmitted from the first EHFcommunication unit to the second EHF communication unit and concurrentlytransmitted from the fourth EHF communication unit to the third EHFcommunication unit.

In another example, an EHF communication unit may include a die having atransmitter circuit and a receiver circuit. A first antenna may beoperatively connected to the transmitter circuit. A second antenna maybe operatively connected to the receiver circuit. Dielectric materialmay encapsulate and hold in relative spaced relationship the firstantenna, the second antenna, and the die. The first and second antennasmay transmit or receive electromagnetic radiation having differentrespective polarization characteristics.

The first and second antennas may transmit or receive linearly polarizedelectromagnetic radiation and a first polarization direction vector ofthe first antenna may be oriented orthogonally to a second polarizationdirection vector of the second antenna.

The first antenna may transmit one of right-handed and left-handedpolarized electromagnetic radiation, and the second antenna may receivethe other of right-handed and left-handed polarized electromagneticradiation.

The die may have a length and a width. The first antenna may be locatedat a first port disposed at a point along the length, and the secondantenna may be located at a second port disposed at a point along thewidth.

The die may have a plurality of corners. The first antenna may belocated proximate to one corner, and the second antenna may be locatedproximate to another corner.

The length and width of the chip may each be about 1.0 mm to about 2.0mm.

The communication unit may also include a dielectric substrate and anEHF radiation-blocking structure disposed in the substrate. The EHFelectromagnetic comm-link chip package may be mounted on the substratewith the first and second antennas being disposed at spaced-apartpositions on the substrate. The substrate may extend between the firstantenna and the second antenna, defining a radiation propagation path.The EHF radiation-blocking structure may be disposed in the substrateand extend at least partly across the propagation path.

The communication unit may also include a ground plane attached to thesubstrate. The EHF radiation-blocking structure may include a via fencehaving a strip of conductive material on a surface of the substrate anda plurality of spaced-apart vias formed along a length of the strip ofconductive material. The vias may electrically connect the strip ofconductive material to the ground plane.

The plurality of vias may be spaced apart at intervals less than awavelength of a device operating frequency.

In a further example, a system may include first and secondcommunication devices. The first communication device may include afirst EHF electromagnetic comm-link chip having a first antennaconfigured as a transmitter and a second antenna configured as areceiver. The second communication device may include a second EHFcomm-link chip having a third antenna configured as a transmitter and afourth antenna configured as a receiver. The first antenna may beconfigured to transmit and the fourth antenna may be configured toreceive electromagnetic radiation having a first polarizationcharacteristic. The third antenna may be configured to transmit and thesecond antenna may be configured to receive electromagnetic radiationhaving a second polarization characteristic that is different than thefirst polarization characteristic. The first device and the seconddevice may be configured so that when the first device is placedproximate to and in lateral alignment with the second device, the firstantenna is aligned with and facing the fourth antenna and the secondantenna is aligned with and facing the third antenna.

In another example, a chip assembly may have a first EHF comm-link chip,a first antenna operatively coupled to the first EHF comm-link chip, asecond EHF comm-link chip, a second antenna operatively coupled to thesecond EHF comm-link chip, and a dielectric substrate holding the firstantenna in a spaced relationship relative to the second antenna. Thefirst EHF comm-link chip and first antenna may be configured as atransmitter that transmits electromagnetic radiation having a firstpolarization characteristic. The second EHF comm-link chip and thesecond antenna may be configured as a receiver that receiveselectromagnetic radiation having a second polarization characteristicthat is different than the first polarization characteristic.

The first antenna may transmit one of right-handed and left-handedelliptically polarized electromagnetic radiation, and the second antennamay receive the other of right-handed and left-handed ellipticallypolarized electromagnetic radiation.

The first antenna may transmit and the second antenna may receivelinearly polarized electromagnetic radiation. The first antenna may beoriented to produce electromagnetic radiation that is orthogonal toradiation produced by the second antenna.

Each EHF comm-link chip may also include a first end to which theassociated antenna is connected and a second end opposite the first end;wherein the respective second ends are spaced farther apart than therespective first ends. Electromagnetic radiation transmitted from thefirst antenna may extend at least partially through a common region, andelectromagnetic radiation received by the second antenna may also extendat least partially through the common region.

The first antenna may direct transmitted radiation along a first paththat is transverse to a second path of radiation received by the secondantenna. The first path of radiation may intersect the second path ofradiation. Alternatively, the first path of radiation may not intersectthe second path of radiation.

INDUSTRIAL APPLICABILITY

The inventions described herein relate to industrial and commercialindustries, such as electronics and communications industries usingdevices that communicate with other devices or devices havingcommunication between components in the devices.

It is believed that the disclosure set forth herein encompasses multipledistinct inventions with independent utility. While each of theseinventions has been disclosed in its preferred form, the specificembodiments thereof as disclosed and illustrated herein are not to beconsidered in a limiting sense as numerous variations are possible. Eachexample defines an embodiment disclosed in the foregoing disclosure, butany one example does not necessarily encompass all features orcombinations that may be eventually claimed. Where the descriptionrecites “a” or “a first” element or the equivalent thereof, suchdescription includes one or more such elements, neither requiring norexcluding two or more such elements. Further, ordinal indicators, suchas first, second or third, for identified elements are used todistinguish between the elements, and do not indicate a required orlimited number of such elements, and do not indicate a particularposition or order of such elements unless otherwise specifically stated.

We claim:
 1. An extremely high frequency (“EHF”) communication device,comprising: one or more dies that include a transmitter circuit and areceiver circuit; a first antenna operatively connected to thetransmitter circuit; a second antenna operatively connected to thereceiver circuit; a dielectric structure; and an EHF radiation-blockingstructure; wherein the one or more dies and first and second antennasare supported relative to the dielectric structure with the first andsecond antennas being disposed at spaced-apart positions, the dielectricstructure extending between the first antenna and the second antennadefining a first path of radiation propagation; and wherein the EHFradiation-blocking structure extends into the dielectric structure in anuninterrupted line across the first path adjacent one of the one or moredies, the EHF radiation-blocking structure being configured to impedepropagation of radiation having an operating frequency of the first andsecond antennas, from the first and second antennas through the EHFradiation-blocking structure.
 2. The communication device of claim 1,wherein the one die has a length and a width and includes thetransmitter circuit and the receiver circuit; the first antenna islocated at a first port disposed at a point along the length; and thesecond antenna is located at a second port disposed at a point along thewidth.
 3. The communication device of claim 2, wherein the one die has aplurality of corners; the first antenna is located proximate to a firstcorner; the second antenna is located proximate to a second corner; andthe EHF radiation-blocking structure extends from a third corner betweenthe first and second corners.
 4. The communication device of claim 2,wherein the length and width of the one die are each about 1.0 mm toabout 2.0 mm.
 5. The communication device of claim 1, further comprisinga ground plane attached to the dielectric structure and wherein the EHFradiation-blocking structure includes a via fence extending across thefirst path between the first and second antennas and having a strip ofconductive material on a surface of the dielectric structure and only asingle row of spaced-apart vias formed along a length of the strip ofconductive material, the vias electrically connecting the strip ofconductive material to the ground plane.
 6. The communication device ofclaim 5, wherein the plurality of vias are spaced apart at intervalsless than a wavelength of the operating frequency.
 7. A chip assemblyhaving a first extremely high frequency (“EHF”) comm-link chip, a firstantenna operatively coupled to the first EHF comm-link chip, a secondEHF comm-link chip, a second antenna operatively coupled to the secondEHF comm-link chip, a dielectric structure supporting the first antennain a spaced relationship relative to the second antenna, and an EHFradiation-blocking structure, the first and second EHF comm-link chipsand first and second antennas being mounted on the substrate with thefirst and second antennas being disposed at spaced-apart positions; thedielectric structure extending between the first antenna and the secondantenna defining a first path of radiation propagation; and the EHFradiation-blocking structure extending in the dielectric structure in anuninterrupted line across the first path adjacent the first EHFcomm-link chip, the EHF radiation-blocking structure being configured toimpede radiation haying an operating frequency of the first antenna frompropogating in the dielectric structure from the first and secondantennas through the EHF radiation-blocking structure; the first EHFcomm-link chip and first antenna being configured as a transmitter thattransmits electromagnetic radiation and the second EHF comm-link chipand the second antenna being configured as a receiver that receiveselectromagnetic radiation.
 8. The chip assembly of claim 7, wherein eachEHF comm-link chip further comprises a first end to which the associatedantenna is connected and a second end opposite the first end; whereinthe respective second ends are spaced farther apart than the respectivefirst ends, electromagnetic radiation transmitted from the first antennaextends at least partially through a common region separate from thefirst path, and electromagnetic radiation received by the second antennaalso extends at least partially through the common region.
 9. The chipassembly of claim 7, wherein the first antenna directs transmittedradiation along a second path that is transverse to a third path ofradiation received by the second antenna.
 10. The chip assembly of claim9, wherein the second path of radiation intersects the third path ofradiation.
 11. The chip assembly of claim 9, wherein the second path ofradiation does not intersect the third path of radiation.